BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
Smooth and straight connections must be created at PCB (Printed Circuit Board) layout. BGA pins may need to be re-assigned, if the BGA is re-configurable, but that's necessary to keep signals and ...
Recently, we stumbled upon a video by [iBoff], adding an M.2 NVMe port to a 2011-2013 MacBook. Apple laptops never came with proper M.2 ports, especially the A1278 – so what’s up? The trick is – ...
Memory chip packaging designs changed significantly when the industry moved from SDR to DDR. Some common DRAM packaging includes Thin Small-Outline Package (TSOP), Chip-Scale Packaging (CSP), ...
Placement of regulators for core voltage levels closer to the chips that need them Usage of unique materials like ECMs in PCBs and packages to provide power rail capacitance Package-level and ...
One day [Andy] was cruising around eBay and spotted something interesting. Forty Virtex-E FPGAs for two quid each. These are the big boys of the FPGA world, with 512 user IO pins, almost 200,000 logic ...
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