Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...
Olympus Integrated Technologies America presented its 3D-ICautomated metrology system at SEMICON West 2010. The system provides preciseimaging to verify the alignment of bonded wafers and TSVs ...
The linear motors accelerate extremely fast, at rates of up to 150 metres per second squared. That is comparable to a car ...
A new technique measures free-form wafer shape, write Marco Franchi, Wooptix, and Leon van Dijk, Ronald Otten, Richard Van Haren, ASML. On-product overlay (OPO) is one of the most critical parameters ...
Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...
A technique which will allow silicon wafers to be stacked accurately and inexpensively in 3-D structures has been developed by researchers at the University of Southampton. According to Dr Michael ...
Imec and EV Group (EVG) demonstrate a highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch with record high post-bonding alignment accuracy, obtained on a test ...
LAKE SUCCESS, N.Y.--(BUSINESS WIRE)--Canon U.S.A., Inc., a leader in digital imaging solutions, recently announced that it has commenced sales of the new FPA-6300ES6a Deep Ultra-Violet (DUV) scanner, ...
Carbon nanotubes can be five times as energy efficient and five times faster than silicon. engineers at the University of Wisconsin–Madison can align the nanotubes for computer chips by turning them ...
As transistor sizes shrink to their atomic limits, computing demands are only growing. Sending chips to the third dimension is the future: Chips stacked on other chips can get more work done in the ...
The solar industry must work together to agree on standardised larger wafer sizes, according to monocrystalline solar manufacturer LONGi Group. The company has revealed that its H-MO4 module, which ...
Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...
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